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Henkel Highlights New Technologies at IPC APEX Expo 2019

Will show new interconnect, thermal and protection materials.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

At this year’s IPC APEX Expo, taking place Jan. 29-31 in San Diego, CA, Henkel Corporation will debut several new materials.
 
At Henkel’s booth, visitors can learn more about:
 • New LOCTITE solder materials and fluxes for automotive applications.
• Low pressure molding TECHNOMELT to facilitate automated masking of keep out zones prior to conformal coating processes.
• BERGQUIST thermal control solutions in liquid and pad formats ensure effective heat dissipation for increased reliability.
• PCB Protection from a wide range of solvent-free conformal coatings, which safeguard printed circuit boards from thermal shock, moisture, corrosive liquids and other adverse environmental conditions.
• High-temp compatible device protection with LOCTIT ECCOBOND UF 1173 underfill, which combines a high Tg (160°C) with a solder-like low CTE for maximum protection in extreme conditions.  The material, is one of five products selected for an IPC APEX Expo Innovation Award, also complies with current REACH substances of very high concern (SVHC) guidelines.
• Structural adhesives, inks and electrically conductive adhesives that enable modern designs for wearables, streamlined medical devices and in-cabin automotive comfort and functionality.
• Novel EMI conformal shielding materials offer a thin, streamlined replacement for conventional RF isolation approaches.

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